The new capability lets scientists simulate and visually inspect automated experiments before robots run them.

In this Q&A, you will learn about some of the technologies and techniques that are making it possible to address advanced packaging challenges.

A research team led by Professor Jae Eun Jang and Dr. Goeun Pyo from the Department of Electrical Engineering and Computer Science at DGIST has developed "dual-modulated vertically stacked transistors ...

The ‘nanometer’ number in chip manufacturing refers to the size of the smallest parts, like transistor gates. A 5nm process ...

Researchers at Politecnico di Milano and CNR-IFN have demonstrated all-optical logic operations in a tungsten disulfide (WS₂) monolayer at rates as high as 10 terahertz, according to a study published ...

Here is why gallium nitride (GaN) is the natural successor to silicon MOSFETs in the 100–650 V class of power devices.

Here at the University of Connecticut, the College of Engineering’s annual poster competition displayed over 100 posters on the wide array of research engineering graduate students have ...

Oracle-based quantum algorithms cannot use deep loops because quantum states exist only as mathematical amplitudes in Hilbert space with no physical substrate. Criticall ...

Abstract: Conventional complementary metal oxide semiconductor (CMOS) devices rely heavily on doping, which increasingly limits scalability due to process constraints and performance degradations at ...

Device scaling in advanced CMOS nodes is becoming more difficult due to patterning limitations and complex 3-D transistor integration schemes. This also makes the devices more sensitive to patterning ...

The World Anti-Doping Agency (WADA) is often tasked with investigating athletes who may be using illicit substances, but what's happening at the Milano Cortina Olympic Games is new territory. On ...