SEEQC today announced a significant breakthrough in the development of scalable, chip-based quantum computers, with results published in a peer-reviewed study in Nature Electronics. The publication ...

The research team led by Researcher Tianyu Wang from the School of Integrated Circuits at Shandong University has systematically reviewed the latest advances in emerging memristors for in-memory ...

New vertical device architecture promises stable, ultra-dense semiconductor stacking for future AI and high-performance ...

Researchers developed a dual-modulated vertical transistor that suppresses leakage at nanoscale channels and supports ...

Detailed price information for Applied Materials (AMAT-Q) from The Globe and Mail including charting and trades.

Researchers have built a small-scale computer that runs on thermal noise, the random electrical fluctuations that conventional chip designers spend billions trying to suppress. The device, called a ...

A team of Chinese researchers has built a ferroelectric transistor with a gate length of just 1 nanometer that runs on 0.6 ...

Tesla's AI6 chip production on Samsung's 2nm process has been pushed back roughly 6 months, delaying mass production to Q4 2027 and creating ripple effects for other Samsung foundry customers.

In this Q&A, you will learn about some of the technologies and techniques that are making it possible to address advanced packaging challenges.

From quartz sand to silicon wafers, the manufacturing process is critical for achieving the purity and quality needed for advanced semiconductor applications.

Tools designed to verify and monitor physical AI systems offer value, but human oversight is needed to prevent accidents and unexpected behavior.